A positive-type photosensitive resin composition comprising component (A): an alkali-soluble resin having a functional group which undergoes heat crosslinking reaction with a compound of component (B), a functional group for film curing which undergoes thermoset reaction with a compound of component (C), and a number average molecular weight of 2,000 to 30,000; component (B): a compound having two or more vinyl ether groups per molecule; component (C): a compound having two or more blocked isocyanate groups per molecule; component (D): a photoacid generator; and component (E): a solvent. A production process of the positive-type photosensitive resin composition comprising mixing the above-mentioned components and maintaining the mixture at a temperature higher than room temperature. A cured film manufactured by using the positive-type photosensitive resin composition. The composition has a high sensitivity and little film reduction of unexposed part, maintains a high transmittance even after baking at a high temperature or resist stripping treatment, and cause no reduction of film thickness. Therefore, the composition provides a cured film suited as a film material for several displays.