Invention Grant
US08828750B2 Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
有权
高度集成的晶片粘合MEMS器件，具有无释放膜制造用于高密度打印头
- Patent Title: Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
- Patent Title (中): 高度集成的晶片粘合MEMS器件，具有无释放膜制造用于高密度打印头
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Application No.: US13875262Application Date: 2013-05-01
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Publication No.: US08828750B2Publication Date: 2014-09-09
- Inventor: Peter J Nystrom , Peter M Gulvin , Paul W Browne
- Applicant: Xerox Corporation
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B41J2/135
Abstract:
A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrifical layer previously required for forming the actuatable membrane with respect to the driver component.
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