Invention Grant
- Patent Title: Light-emitting element package and fabrication method thereof
- Patent Title (中): 发光元件封装及其制造方法
-
Application No.: US13973941Application Date: 2013-08-22
-
Publication No.: US08828755B2Publication Date: 2014-09-09
- Inventor: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
- Applicant: Advanced Optoelectronic Technology, Inc.
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201010187222 20100531
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.
Public/Granted literature
- US20140051193A1 LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2014-02-20
Information query
IPC分类:
