Invention Grant
- Patent Title: Method of fabricating photodiode
- Patent Title (中): 制造光电二极管的方法
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Application No.: US13742049Application Date: 2013-01-15
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Publication No.: US08828786B2Publication Date: 2014-09-09
- Inventor: Kenichi Miyazaki , Osamu Matsushima
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2009-120769 20090519; JP2009-297205 20091228
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
A light-absorbing layer is composed of a compound-semiconductor film of chalcopyrite structure, a surface layer is disposed on the light-absorbing layer, the surface layer having a higher band gap energy than the compound-semiconductor film, an upper electrode layer is disposed on the surface layer, and a lower electrode layer is disposed on a backside of the light-absorbing layer in opposition to the upper electrode layer, the upper electrode layer and the lower electrode layer having a reverse bias voltage applied in between to detect electric charges produced by photoelectric conversion in the compound-semiconductor film, as electric charges due to photoelectric conversion are multiplied by impact ionization, while the multiplication by impact ionization of electric charges is induced by application of a high-intensity electric field to a semiconductor of chalcopyrite structure, allowing for an improved dark-current property, and an enhanced efficiency even in detection of low illumination intensities, with an enhanced S/N ratio.
Public/Granted literature
- US20130149810A1 METHOD OF FABRICATING PHOTODIODE Public/Granted day:2013-06-13
Information query
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