Invention Grant
US08828799B2 Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
有权
形成集成电路封装的方法，该集成电路封装包括电连接到直接连接焊盘的直接连接焊盘，盲通孔和焊盘
- Patent Title: Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
- Patent Title (中): 形成集成电路封装的方法，该集成电路封装包括电连接到直接连接焊盘的直接连接焊盘，盲通孔和焊盘
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Application No.: US13939804Application Date: 2013-07-11
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Publication No.: US08828799B2Publication Date: 2014-09-09
- Inventor: Kenneth Robert Rhyner , Peter R. Harper
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frederick J. Telecky, Jr.
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/00 ; H01L23/48
Abstract:
A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.
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