Invention Grant
US08828846B2 Method of computing a width of a scribe region based on a bonding structure that extends into the scribe reigon in a wafer-level chip scale (WLCSP) packaging
有权
基于在晶片级芯片尺寸（WLCSP）封装中延伸到划线区域的接合结构来计算划线区域的宽度的方法
- Patent Title: Method of computing a width of a scribe region based on a bonding structure that extends into the scribe reigon in a wafer-level chip scale (WLCSP) packaging
- Patent Title (中): 基于在晶片级芯片尺寸（WLCSP）封装中延伸到划线区域的接合结构来计算划线区域的宽度的方法
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Application No.: US13191349Application Date: 2011-07-26
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Publication No.: US08828846B2Publication Date: 2014-09-09
- Inventor: Philip S. Ng
- Applicant: Philip S. Ng
- Applicant Address: US CA San Jose
- Assignee: Atmel Corporation
- Current Assignee: Atmel Corporation
- Current Assignee Address: US CA San Jose
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
The disclosed WLCSP solution overcomes the limitations of fan-out WLCSP solutions, and other conventional solutions for WLCSP for small, high volume die, by increasing the width of scribe regions between die on a semiconductor substrate to accommodate bonding structures (e.g., solder balls) that partially extend beyond peripheral edges of the die. The scribe regions can be widened in x and y directions on the wafer. The widened scribe regions can be incorporated into the design of the mask set.
Public/Granted literature
- US20130026605A1 WLCSP for Small, High Volume Die Public/Granted day:2013-01-31
Information query
IPC分类:
