Invention Grant
- Patent Title: Method for etching a material in the presence of solid particles
- Patent Title (中): 在固体颗粒存在下蚀刻材料的方法
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Application No.: US13320618Application Date: 2010-05-12
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Publication No.: US08828872B2Publication Date: 2014-09-09
- Inventor: Francis Baillet , Nicolas Gondrexon
- Applicant: Francis Baillet , Nicolas Gondrexon
- Applicant Address: FR Grenoble Cedex FR Saint Matin d'Heres
- Assignee: Institut Polytechnique de Grenoble,Universite Joseph Fourier
- Current Assignee: Institut Polytechnique de Grenoble,Universite Joseph Fourier
- Current Assignee Address: FR Grenoble Cedex FR Saint Matin d'Heres
- Agency: Edwards Wildman Palmer LLP
- Agent Steven M. Jensen; Stephen M. Rafferty
- Priority: FR0953294 20090518
- International Application: PCT/FR2010/050928 WO 20100512
- International Announcement: WO2010/133787 WO 20101125
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
The invention relates to a method for etching a structure (1) including at least one material (4) to be etched, said method consisting in: selecting at least one chemical species that can react with the material (4) to be etched; selecting at least one soluble compound that can release this chemical species; producing a solution (11) containing the compound and a powder of particles or solid grains (13) in suspension; placing the material to be etched in the presence of the solution; and producing high-frequency ultrasounds in the solution, at at least one frequency, capable of generating active cavitation bubbles such that the chemical species is generated and reacts with the material to be etched, thereby producing a soluble compound or a precipitate.
Public/Granted literature
- US20120149196A1 METHOD FOR ETCHING A MATERIAL IN THE PRESENCE OF SOLID PARTICLES Public/Granted day:2012-06-14
Information query
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