Invention Grant
- Patent Title: Photo resist trimmed line end space
- Patent Title (中): 光刻胶裁剪线端面空间
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Application No.: US13734231Application Date: 2013-01-04
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Publication No.: US08828885B2Publication Date: 2014-09-09
- Inventor: Chia-Ying Lee , Jyu-Horng Shieh , Ming-Feng Shieh , Shih-Ming Chang , Chih-Ming Lai , Ken-Hsien Hsieh , Ru-Gun Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
One or more techniques or systems for forming a line end space structure are provided herein. In some embodiments, a first patterned second hard mask (HM) region is formed above a first HM region. Additionally, at least some of the first patterned second HM region is removed. In some embodiments, a first sacrificial HM region and a second sacrificial HM region are formed above at least one of the first patterned second HM region or the first HM region. Photo resist (PR) is patterned above the second sacrificial HM region, and a spacer region is deposited above the patterned PR and second sacrificial HM region. In some embodiments, at least some of at least one of the spacer region, the PR, or the respective sacrificial HMs is removed. In this way, a line end space structure associated with an end-to-end space is formed.
Public/Granted literature
- US20140193981A1 PHOTO RESIST TRIMMED LINE END SPACE Public/Granted day:2014-07-10
Information query
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