Invention Grant
- Patent Title: Laser processing method
- Patent Title (中): 激光加工方法
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Application No.: US13575393Application Date: 2011-01-05
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Publication No.: US08828891B2Publication Date: 2014-09-09
- Inventor: Takeshi Sakamoto
- Applicant: Takeshi Sakamoto
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2010-015538 20100127
- International Application: PCT/JP2011/050055 WO 20110105
- International Announcement: WO2011/093113 WO 20110804
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/42 ; H01L21/324 ; H01L21/477

Abstract:
For modulating laser light for forming a modified region SD3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an object 1, a quality pattern J having a first brightness region extending in a direction substantially orthogonal to a line 5 and second brightness regions located on both sides of the first brightness region in the extending direction of the line 5 is used. After forming modified regions SD1, SD2 at positions closer to the rear face 21 but before forming modified regions SD4, SD5 at positions closer to the rear face 21 while using the front face 3 as a laser light entrance surface, the modified region SD3 is formed at the intermediate position by irradiation with laser light modulated according to a modulation pattern including the quality pattern J.
Public/Granted literature
- US20120329247A1 LASER PROCESSING METHOD Public/Granted day:2012-12-27
Information query
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