Invention Grant
- Patent Title: Radiation imaging apparatus, radiation imaging system, and method for manufacturing radiation imaging apparatus
- Patent Title (中): 辐射成像装置，放射线成像系统及其制造方法
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Application No.: US13324037Application Date: 2011-12-13
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Publication No.: US08829456B2Publication Date: 2014-09-09
- Inventor: Satoru Sawada , Masato Inoue , Shinichi Takeda , Takamasa Ishii , Taiki Takei , Masayoshi Akiyama
- Applicant: Satoru Sawada , Masato Inoue , Shinichi Takeda , Takamasa Ishii , Taiki Takei , Masayoshi Akiyama
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Divison
- Priority: JP2011-004650 20110113
- Main IPC: G01T1/20
- IPC: G01T1/20 ; H01L31/0232
Abstract:
A radiation imaging apparatus includes a substrate, at least one imaging element, a scintillator, a first heat peelable adhesive member which fixes the substrate to the imaging element, and a second heat peelable adhesive member which fixes the imaging element to the scintillator. An adhesive strength of the first heat peelable member is decreased by heat. A temperature of the first heat peelable adhesive member at which the adhesive strength is decreased is substantially equal to a temperature at which second heat peelable adhesive member fixes the imaging element to the scintillator. A heat transfer quantity per unit time of the substrate is different from that of the scintillator.
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