Invention Grant
US08829537B2 Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
有权
集成设备包括驱动器芯片，电源和LED芯片在隔离基板上
- Patent Title: Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
- Patent Title (中): 集成设备包括驱动器芯片，电源和LED芯片在隔离基板上
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Application No.: US13239569Application Date: 2011-09-22
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Publication No.: US08829537B2Publication Date: 2014-09-09
- Inventor: Yang-Kuao Kuo , Chin-Peng Wang , Lea-Hwung Leu
- Applicant: Yang-Kuao Kuo , Chin-Peng Wang , Lea-Hwung Leu
- Applicant Address: TW Taoyuan County
- Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
- Current Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
- Current Assignee Address: TW Taoyuan County
- Agency: Jackson IPG PLLC
- Priority: TW100127714A 20110804
- Main IPC: H01L33/00
- IPC: H01L33/00 ; F21V29/00 ; H05K1/02 ; F21V23/00 ; H05B33/08 ; H05K1/03 ; H01L25/075 ; H05K3/00 ; F21Y101/02 ; F21Y105/00
Abstract:
Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
Public/Granted literature
- US20130032826A1 Integrated Apparatus Including Driver Chips, a Power Supply and LED Chips on an Isolative Substrate Public/Granted day:2013-02-07
Information query
IPC分类:
