Invention Grant
- Patent Title: Metallic frame structure and LED device having the same
- Patent Title (中): 金属框架结构和具有相同的LED装置
-
Application No.: US13620556Application Date: 2012-09-14
-
Publication No.: US08829561B2Publication Date: 2014-09-09
- Inventor: Chen-Hsiu Lin , Yi-Chien Chang
- Applicant: Chen-Hsiu Lin , Yi-Chien Chang
- Applicant Address: CN Guangzhou TV Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee Address: CN Guangzhou TV Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201210088452 20120330
- Main IPC: H01L33/62
- IPC: H01L33/62
Abstract:
The present invention relates to an LED device, which includes a metallic frame, an LED chip, and a packaging body. The metallic frame includes a first lead frame and a second lead frame. The first lead frame has a protruding portion extending toward the second lead frame, while the second lead frame has a notch formed correspondingly to the protruding portion. An electrically insulated region is cooperatively defined by the first and second lead frames. The metallic frame defines at least one blind hole in proximate to the electrically insulated region. The LED chip is electrically connected to the first and second lead frames. The packaging body has a base portion encapsulating the metallic frame and a light-permitting portion arranged above the LED chip.
Public/Granted literature
- US20130256733A1 METALLIC FRAME STRUCTURE AND LED DEVICE HAVING THE SAME Public/Granted day:2013-10-03
Information query
IPC分类:
