Invention Grant
US08829562B2 Semiconductor device including a dielectric structure in a trench
有权
包括在沟槽中的电介质结构的半导体器件
- Patent Title: Semiconductor device including a dielectric structure in a trench
- Patent Title (中): 包括在沟槽中的电介质结构的半导体器件
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Application No.: US13556335Application Date: 2012-07-24
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Publication No.: US08829562B2Publication Date: 2014-09-09
- Inventor: Hans-Joachim Schulze , Franz Hirler , Hans-Peter Felsl , Franz-Josef Niedernostheide
- Applicant: Hans-Joachim Schulze , Franz Hirler , Hans-Peter Felsl , Franz-Josef Niedernostheide
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/336

Abstract:
A semiconductor device includes a trench extending into a drift zone of a semiconductor body from a first surface. The semiconductor device further includes a gate electrode in the trench and a body region adjoining a sidewall of the trench. The semiconductor device further includes a dielectric structure in the trench. The dielectric structure includes a high-k dielectric in a lower part of the trench. The high-k dielectric includes a dielectric constant higher than that of SiO2. An extension of the high-k dielectric in a vertical direction perpendicular to the first surface is limited between a bottom side of the trench and a level where a bottom side of the body region adjoins the sidewall of the trench.
Public/Granted literature
- US20140027812A1 Semiconductor Device Including a Dielectric Structure in a Trench Public/Granted day:2014-01-30
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