Invention Grant
- Patent Title: Solid-state image pickup deviceand fabrication process thereof
- Patent Title (中): 固体摄像装置及其制造方法
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Application No.: US12860158Application Date: 2010-08-20
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Publication No.: US08829636B2Publication Date: 2014-09-09
- Inventor: Tomokazu Ohchi , Yuki Miyanami , Shinichi Arakawa
- Applicant: Tomokazu Ohchi , Yuki Miyanami , Shinichi Arakawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Chicago Technology Law Group, LLC
- Agent Robert J. Depke
- Priority: JP2009-202301 20090902; JP2010-127960 20100603
- Main IPC: H01L31/102
- IPC: H01L31/102
Abstract:
A solid-state image pickup device has photodiodes, each of which includes an N-type region formed in a semiconductor substrate, a first silicon carbide layer formed above the N-type region, and a P-type region including a first silicon layer formed above the first silicon carbide layer and doped with boron. A fabrication process of such a solid-state image pickup device is also disclosed.
Public/Granted literature
- US20110204467A1 SOLID-STATE IMAGE PICKUP DEVICEAND FABRICATION PROCESS THEREOF Public/Granted day:2011-08-25
Information query
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