Invention Grant
- Patent Title: Method of forming a dual-trench field effect transistor
- Patent Title (中): 形成双沟道场效应晶体管的方法
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Application No.: US12893997Application Date: 2010-09-29
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Publication No.: US08829641B2Publication Date: 2014-09-09
- Inventor: Bruce D. Marchant
- Applicant: Bruce D. Marchant
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In one general aspect, a method of forming a field effect transistor can include forming a well region in a semiconductor region of a first conductivity type where the well region is of a second conductivity type and has an upper surface and a lower surface. The method can include forming a gate trench extending into the semiconductor region to a depth below a depth of the lower surface of the well region, and forming a stripe trench extending through the well region and into the semiconductor region to a depth below the depth of the gate trench. The method can also include forming a contiguous source region of the first conductivity type in the well region where the source region being in contact with the gate trench and in contact with the stripe trench.
Public/Granted literature
- US20110014764A1 METHOD OF FORMING A DUAL-TRENCH FIELD EFFECT TRANSISTOR Public/Granted day:2011-01-20
Information query
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