Invention Grant
- Patent Title: Nitride-based semiconductor substrate and semiconductor device
- Patent Title (中): 基于氮化物的半导体衬底和半导体器件
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Application No.: US11397931Application Date: 2006-04-05
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Publication No.: US08829651B2Publication Date: 2014-09-09
- Inventor: Yuichi Oshima
- Applicant: Yuichi Oshima
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2005-350749 20051205
- Main IPC: H01L29/20
- IPC: H01L29/20

Abstract:
A nitride-based semiconductor substrate has a diameter of 25 mm or more, a thickness of 250 micrometers or more, a n-type carrier concentration of 1.2×1018 cm−3 or more and 3×1019 cm−3 or less, and a thermal conductivity of 1.2 W/cmK or more and 3.5 W/cmK or less. Alternatively, the substrate has an electron mobility μ [cm2/Vs] of more than a value represented by loge μ=17.7−0.288 loge n and less than a value represented by loge μ=18.5−0.288 loge n, where the substrate has a n-type carrier concentration n [cm−3] that is 1.2×1018 cm−3 or more and 3×1019 cm−3 or less.
Public/Granted literature
- US20070128753A1 Nitride-based semiconductor substrate and semiconductor device Public/Granted day:2007-06-07
Information query
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