Invention Grant
- Patent Title: Integrated circuit
- Patent Title (中): 集成电路
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Application No.: US12850201Application Date: 2010-08-04
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Publication No.: US08829659B2Publication Date: 2014-09-09
- Inventor: Xiaobing Sun , Yaqiong Zhang , Yugang Ma
- Applicant: Xiaobing Sun , Yaqiong Zhang , Yugang Ma
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: SG200905424-8 20090812
- Main IPC: H01L29/93
- IPC: H01L29/93
Abstract:
An integrated circuit connection comprises a substrate, first and second transmission lines, a die, and a conductive ribbon. The first transmission line has a first end and is arranged on the substrate. The die is spaced from the first end. The die has a first surface, which is arranged on the substrate, and a second surface, which is opposite to the first surface and which has the second transmission line arranged thereon. The second transmission line has a second end. The conductive ribbon electrically couples the first and the second ends.
Public/Granted literature
- US20110037178A1 INTEGRATED CIRCUIT Public/Granted day:2011-02-17
Information query
IPC分类:
