Invention Grant
- Patent Title: Warp compensated package and method
- Patent Title (中): 经修补包和方法
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Application No.: US11372666Application Date: 2006-03-10
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Publication No.: US08829661B2Publication Date: 2014-09-09
- Inventor: William H. Lytle , Scott M. Hayes , George R. Leal
- Applicant: William H. Lytle , Scott M. Hayes , George R. Leal
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/00 ; H01L21/683 ; H01L21/56 ; H01L23/538 ; H01L23/544
Abstract:
Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).
Public/Granted literature
- US20070210427A1 Warp compensated package and method Public/Granted day:2007-09-13
Information query
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