Invention Grant
US08829667B2 Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same
有权
包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法
- Patent Title: Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same
- Patent Title (中): 包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法
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Application No.: US13968731Application Date: 2013-08-16
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Publication No.: US08829667B2Publication Date: 2014-09-09
- Inventor: Young-Woo Park , Wang-Ju Lee , In-Sang Song
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2012-0089892 20120817
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31
Abstract:
An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.
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Information query
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