Invention Grant
US08829689B2 Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
有权
具有用于更换故障芯片的特征的模块基板，具有该故障芯片的半导体模块以及用于制造半导体模块的方法
- Patent Title: Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
- Patent Title (中): 具有用于更换故障芯片的特征的模块基板，具有该故障芯片的半导体模块以及用于制造半导体模块的方法
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Application No.: US12980533Application Date: 2010-12-29
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Publication No.: US08829689B2Publication Date: 2014-09-09
- Inventor: Ki Young Kim , Sung Ho Hyun , Myung Gun Park , Jin Ho Bae
- Applicant: Ki Young Kim , Sung Ho Hyun , Myung Gun Park , Jin Ho Bae
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2010-0057060 20100616
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/14 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/34 ; H05K7/20 ; H05K7/00 ; H05K3/22 ; H01L21/66 ; H01L25/065 ; H01L23/00 ; H05K3/34
Abstract:
A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.
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