Invention Grant
- Patent Title: Light-emitting device package and method of manufacturing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13244510Application Date: 2011-09-25
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Publication No.: US08829691B2Publication Date: 2014-09-09
- Inventor: Jae-yun Lim , Kook-jin Oh , Joon-gil Lee
- Applicant: Jae-yun Lim , Kook-jin Oh , Joon-gil Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0001793 20110107
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44

Abstract:
A light-emitting device package includes: a package body on which a mount portion and a terminal portion are disposed; a light-emitting device chip that is mounted on the mount portion; and a bonding wire that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion that rises from the light-emitting device chip to a loop peak, and an extended portion that connects the loop peak and the terminal portion. A first kink portion, which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion.
Public/Granted literature
- US20120175665A1 LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-07-12
Information query
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