Invention Grant
- Patent Title: Piezoelectric resonator operating in thickness shear mode
- Patent Title (中): 压电谐振器在厚度剪切模式下工作
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Application No.: US13056677Application Date: 2009-07-28
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Publication No.: US08829766B2Publication Date: 2014-09-09
- Inventor: Evgeny Milyutin , Paul Muralt
- Applicant: Evgeny Milyutin , Paul Muralt
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Sturm & Fix LLP
- International Application: PCT/IB2009/053274 WO 20090728
- International Announcement: WO2010/013197 WO 20100204
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H03H9/58 ; H03H9/17 ; H01L41/107 ; H03H9/56 ; H03H9/02

Abstract:
An acoustic wave resonator device comprising a resonant layer that comprises a series of side-by-side areas of first and second dielectric materials. In one embodiment the first dielectric material is a piezoelectric, in particular the first dielectric material can be a piezoelectric and the second dielectric material can be non-piezoelectric. In another embodiment, the first dielectric material is a piezoelectric of first polarity and the second dielectric material is a piezoelectric of opposite polarity or different polarity. Where needed, the resonant layer is supported on a reflector composed of series of layers of high acoustic impedance material(s) alternating with layers of low acoustic impedance material(s). For example, the reflector comprises AlN, Al2O3, Ta2O5, HfO2 or W as high impedance material and SiO2 as low impedance material.
Public/Granted literature
- US20110121683A1 Piezoelectric Resonator Operating In Thickness Shear Mode Public/Granted day:2011-05-26
Information query
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