Invention Grant
- Patent Title: Haptic feedback device
- Patent Title (中): 触觉反馈装置
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Application No.: US13332368Application Date: 2011-12-21
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Publication No.: US08829768B2Publication Date: 2014-09-09
- Inventor: Lin Liu
- Applicant: Lin Liu
- Applicant Address: CN Shenzhen US CA La Verne
- Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee Address: CN Shenzhen US CA La Verne
- Agency: Anova Law Group, PLLC
- Priority: CN201110002750 20110107
- Main IPC: H01L41/09
- IPC: H01L41/09

Abstract:
Disclosed is a haptic feedback device used in an electronic device for providing haptic feedback. The haptic feedback device includes an electronic board defining at least two supporting elements and a receiving cavity, a piezoelectric vibrator coupling to the supporting elements and at least partially received in the receiving cavity. The piezoelectric vibrator is capable of vibrating along a direction parallel to the electronic board. At least two bolts are provided to fix the piezoelectric vibrator on the electronic board through the supporting element along a direction parallel to the electronic board.
Public/Granted literature
- US20120176758A1 HAPTIC FEEDBACK DEVICE Public/Granted day:2012-07-12
Information query
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