Invention Grant
- Patent Title: Surface mountable thermistor
- Patent Title (中): 表面贴装热敏电阻
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Application No.: US13604154Application Date: 2012-09-05
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Publication No.: US08830027B2Publication Date: 2014-09-09
- Inventor: Yi An Sha , Chun Teng Tseng , David Shau Chew Wang
- Applicant: Yi An Sha , Chun Teng Tseng , David Shau Chew Wang
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corp.
- Current Assignee: Polytronics Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Egbert Law Offices, PLLC
- Priority: TW101102423 20120120
- Main IPC: H01C7/00
- IPC: H01C7/00

Abstract:
A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.2 W/mK-13 W/mK.
Public/Granted literature
- US20130187748A1 SURFACE MOUNTABLE THERMISTOR Public/Granted day:2013-07-25
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