Invention Grant
- Patent Title: Sensor placement and analysis using a virtual environment
- Patent Title (中): 使用虚拟环境进行传感器放置和分析
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Application No.: US13017969Application Date: 2011-01-31
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Publication No.: US08830230B2Publication Date: 2014-09-09
- Inventor: Hao Bai , Henry Chen , Jian Geng Du , Tom Plocher
- Applicant: Hao Bai , Henry Chen , Jian Geng Du , Tom Plocher
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06T15/00
- IPC: G06T15/00 ; G08B13/196 ; G06T15/20

Abstract:
A process for sensor placement and analysis using a virtual environment includes receiving into a computer processor a model of an area, a position in the model that represents a placement of a virtual sensor, and an orientation of the virtual sensor. A shadow map of the area is generated as a function of the position and orientation of the virtual sensor. The shadow map is used to determine one or more portions of the area that can be sensed by the virtual sensor. The area of the model that is covered as a function of the position and orientation of the virtual sensor is determined, and information relating to the area of the model that is covered as a function of the position and orientation of the virtual sensor is transmitted to an output device.
Public/Granted literature
- US20120197600A1 SENSOR PLACEMENT AND ANALYSIS USING A VIRTUAL ENVIRONMENT Public/Granted day:2012-08-02
Information query
IPC分类:
G | 物理 |
G06 | 计算;推算或计数 |
G06T | 一般的图像数据处理或产生 |
G06T15/00 | 3D〔三维〕图像的加工 |