Invention Grant
US08830557B2 Methods of fabricating MEMS with spacers between plates and devices formed by same
有权
制造具有由板形成的间隔物的MEMS与由其形成的器件的方法
- Patent Title: Methods of fabricating MEMS with spacers between plates and devices formed by same
- Patent Title (中): 制造具有由板形成的间隔物的MEMS与由其形成的器件的方法
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Application No.: US13608949Application Date: 2012-09-10
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Publication No.: US08830557B2Publication Date: 2014-09-09
- Inventor: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
- Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/02 ; G02B26/08

Abstract:
Methods of fabricating an electromechanical systems (EMS) device with spacers between plates and EMS devices formed by the same are disclosed. In one embodiment, a EMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier may be released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the EMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The resulting EMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Public/Granted literature
- US20130003160A1 METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME Public/Granted day:2013-01-03
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