An exposure method is provided. In (a) of FIG. 8, exposure is performed while a substrate 20 is being transported in the Y direction, to simultaneously form first layers 81 and layers 91 in first non-display regions 51 and the display region, respectively, on the substrate 20. Next, in (b) of FIG. 8, the substrate 20 is rotated by 90 degrees, and exposure is performed while the substrate 20 is being transported in the X direction, to form second layers 82 in second non-display regions 52. Subsequently, in (c) of FIG. 8, proximity exposure is performed once on the substrate 20 to simultaneously form third layers 83 on the first layers 81 in the first non-display regions 51, fourth layers 84 on the second layers 82 in the second non-display regions 52, and layers 92 in the display region 40.