Invention Grant
- Patent Title: Systems and methods for heat extraction in a power supply
- Patent Title (中): 电源中的热提取系统和方法
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Application No.: US13552049Application Date: 2012-07-18
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Publication No.: US08830680B2Publication Date: 2014-09-09
- Inventor: Albert Lui , Tom Sidlauskas
- Applicant: Albert Lui , Tom Sidlauskas
- Applicant Address: US CA San Jose
- Assignee: Public Wireless, Inc.
- Current Assignee: Public Wireless, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.
Public/Granted literature
- US20130021755A1 SYSTEMS AND METHODS FOR HEAT EXTRACTION IN A POWER SUPPLY Public/Granted day:2013-01-24
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