Invention Grant
- Patent Title: Encapsulated electronic device
- Patent Title (中): 封装电子设备
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Application No.: US11766028Application Date: 2007-06-20
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Publication No.: US08830695B2Publication Date: 2014-09-09
- Inventor: Silvio Grespan
- Applicant: Silvio Grespan
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Fish & Richardson P.C.
- Priority: DE102007003807 20070125; DE102007012504 20070315
- Main IPC: H01R12/16
- IPC: H01R12/16 ; H01L51/52 ; H01L23/04

Abstract:
An electronic device includes a substrate (1), an electronic component (2) seated on the substrate (1), and a cover (3) across the electronic component (2) with a space (330) between the cover (3) and the electronic component (2). The cover (3) is configured on an inside (32) facing the electronic component (2) in such fashion that the cover (3) has at least one support structure (4, 40) protruding into the space (330).
Public/Granted literature
- US20080180923A1 ENCAPSULATED ELECTRONIC DEVICE Public/Granted day:2008-07-31
Information query