Invention Grant
- Patent Title: Methods and systems for an interposer board
- Patent Title (中): 插入板的方法和系统
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Application No.: US13386989Application Date: 2010-01-29
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Publication No.: US08832348B2Publication Date: 2014-09-09
- Inventor: Darren J. Cepulis , Masud M. Reza , Michael Stearns , Chanh V. Hua
- Applicant: Darren J. Cepulis , Masud M. Reza , Michael Stearns , Chanh V. Hua
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2010/022563 WO 20100129
- International Announcement: WO2011/093877 WO 20110804
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F1/26 ; G06F1/20 ; G06F1/18
Abstract:
In accordance with at least some embodiments, a system (100) includes an aggregator backplane (124) coupled to a plurality of fans (120A-120N) and power supplies (122A-122N) and configured to consolidate control and monitoring for the plurality of fans (120A-120N) and power supplies (122A-122N). The system (100) also includes a plurality of compute nodes (102A-102N) coupled to the aggregator backplane (124), wherein each compute node (102A-102N) selectively communicates with the aggregator backplane (124) via a corresponding interposer board (130A-130N). Each interposer board (130A-130N) is configured to translate information passed between its corresponding compute node (102A-102N) and the aggregator backplane (124).
Public/Granted literature
- US20120131249A1 METHODS AND SYSTEMS FOR AN INTERPOSER BOARD Public/Granted day:2012-05-24
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