Invention Grant
- Patent Title: Support apparatus and information processing method thereof
- Patent Title (中): 支持装置及其信息处理方法
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Application No.: US13347078Application Date: 2012-01-10
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Publication No.: US08832637B2Publication Date: 2014-09-09
- Inventor: Toshisato Sadamatsu , Shinichi Hama
- Applicant: Toshisato Sadamatsu , Shinichi Hama
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Priority: JP2011-013373 20110125
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Layout information indicating locations of at least components and conductive layers in a printed circuit board, and layouts of conductive wiring patterns on the respective conductive layers and vias which electrically connect between the conductive layers is obtained from a memory. With reference to the layout information, path information indicating a path of one signal line is generated. With reference to the layout information and path information, a divide portion where a path of a return current corresponding to a signal current of the signal line is divided are detected. With reference to the layout information and path information, information indicating a detour path of the return current in a neighborhood of the divide portion is generated.
Public/Granted literature
- US20120192140A1 SUPPORT APPARATUS AND INFORMATION PROCESSING METHOD THEREOF Public/Granted day:2012-07-26
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