An apparatus for purge to prevent AMC & natural oxide includes an FOUP configured to contain wafers and to have a receipt supply hole for supplying gas and a receipt discharge hole for discharging the gas at a lower part of the FOUP; stage units each configured to have the FOUP separated therefrom or seated therein, to support the seated FOUP, and to have a gas supply hole for supplying the gas at a position corresponding to the receipt supply hole and a gas discharge hole for discharging the gas at a position corresponding to the receipt discharge hole; a first gas supply port unit disposed in response to the gas supply hole and configured to supply the gas to the FOUP; and a first gas discharge port unit disposed in response to the gas discharge hole and configured to discharge the gas from the FOUP.