Invention Grant
- Patent Title: Plasma processing apparatus and maintenance method therefor
- Patent Title (中): 等离子体处理装置及其维护方法
-
Application No.: US12538986Application Date: 2009-08-11
-
Publication No.: US08833089B2Publication Date: 2014-09-16
- Inventor: Takumi Tandou , Masaru Izawa
- Applicant: Takumi Tandou , Masaru Izawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-149789 20090624
- Main IPC: F25B9/00
- IPC: F25B9/00 ; F25B45/00 ; H01J37/32

Abstract:
In a plasma processing apparatus, a check valve is installed close to a refrigerant inlet of a compressor. When performing maintenance of a sample stage, refrigerant collected from a refrigerant flow path is temporarily stored in a flow path section extending from an expansion valve to the check valve, making it possible to perform the maintenance without changing the amount of refrigerant in the refrigerating cycle. With a refrigerant storage tank, a refrigerant supply valve, and a refrigerant discharge valve included in the refrigerating cycle, when maintenance of the compressor, a condenser, or the expansion valve is performed, the refrigerant collected from the refrigerating cycle can be put in use again.
Public/Granted literature
- US20100326094A1 PLASMA PROCESSING APPARATUS AND MAINTENANCE METHOD THEREFOR Public/Granted day:2010-12-30
Information query