Invention Grant
- Patent Title: Microscale cooling apparatus and method
- Patent Title (中): 微型冷却装置及方法
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Application No.: US12511945Application Date: 2009-07-29
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Publication No.: US08833435B2Publication Date: 2014-09-16
- Inventor: Matthew Determan , Scott W. C. H. Lee , Abel Manuel Siu Ho , Seri Lee
- Applicant: Matthew Determan , Scott W. C. H. Lee , Abel Manuel Siu Ho , Seri Lee
- Applicant Address: US HI Honolulu
- Assignee: Pipeline Micro, Inc.
- Current Assignee: Pipeline Micro, Inc.
- Current Assignee Address: US HI Honolulu
- Agency: Ganz Law, P.C.
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F28F3/12 ; F28D15/02 ; H01L23/427 ; F28D21/00

Abstract:
A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
Public/Granted literature
- US20100032150A1 MICROSCALE COOLING APPARATUS AND METHOD Public/Granted day:2010-02-11
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