Invention Grant
- Patent Title: Seal structure for electronic equipment
- Patent Title (中): 电子设备密封结构
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Application No.: US13059595Application Date: 2009-08-06
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Publication No.: US08833772B2Publication Date: 2014-09-16
- Inventor: Takashi Sasaki , Tomoko Nakano , Naohiro Fujisawa , Keiichi Miyajima
- Applicant: Takashi Sasaki , Tomoko Nakano , Naohiro Fujisawa , Keiichi Miyajima
- Applicant Address: JP
- Assignee: Nippon Mektron, Ltd.
- Current Assignee: Nippon Mektron, Ltd.
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2008-217678 20080827; JP2009-071689 20090324
- International Application: PCT/JP2009/063912 WO 20090806
- International Announcement: WO2010/024097 WO 20100304
- Main IPC: F16J15/02
- IPC: F16J15/02 ; H05K5/06 ; F16J15/10

Abstract:
In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.
Public/Granted literature
- US20110140375A1 SEAL STRUCTURE FOR ELECTRONIC EQUIPMENT Public/Granted day:2011-06-16
Information query
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