Invention Grant
- Patent Title: Liquid ejection head and method of manufacturing the same
- Patent Title (中): 液体喷射头及其制造方法
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Application No.: US13749346Application Date: 2013-01-24
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Publication No.: US08833901B2Publication Date: 2014-09-16
- Inventor: Yoshihiro Hamada , Tadayoshi Inamoto , Isao Imamura , Hiroki Kihara
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper and Scinto
- Priority: JP2012-022995 20120206
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41J2/14 ; H01L21/02

Abstract:
A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.
Public/Granted literature
- US20130201249A1 LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-08-08
Information query
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