Invention Grant
- Patent Title: Shielded modular jack assembly
- Patent Title (中): 屏蔽模块插座组件
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Application No.: US13498464Application Date: 2010-09-28
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Publication No.: US08834196B2Publication Date: 2014-09-16
- Inventor: Jaime Duran , Jeng-De Lin
- Applicant: Jaime Duran , Jeng-De Lin
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- International Application: PCT/US2010/050514 WO 20100928
- International Announcement: WO2011/038387 WO 20110331
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H01R9/03 ; H01R13/6592 ; H01R24/64

Abstract:
An electrical connector has a conductive member with a conductor receiving shoulder to at least partially define a conductor receiving receptacle at which a conductor may be positioned and a movable conductor engaging member configured for movement along a first path. At one position along the first path, the conductor is engaged between the conductor receiving shoulder and the conductor engaging member. The conductor engaging member also moves along a second path that intersects with the first path. At one of the positions along the second path, the conductor engaging member is retained to permit insertion of a conductor into the conductor receiving receptacle.
Public/Granted literature
- US20120244736A1 SHIELDED MODULAR JACK ASSEMBLY Public/Granted day:2012-09-27
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