Invention Grant
US08834211B2 Grounding apparatus and grounding systems including the same for meter enclosure mounting
有权
接地装置和接地系统包括用于仪表外壳安装的接地装置和接地系统
- Patent Title: Grounding apparatus and grounding systems including the same for meter enclosure mounting
- Patent Title (中): 接地装置和接地系统包括用于仪表外壳安装的接地装置和接地系统
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Application No.: US13688590Application Date: 2012-11-29
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Publication No.: US08834211B2Publication Date: 2014-09-16
- Inventor: David Roger Sommer
- Applicant: Eaton Corporation
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agency: Eckert Seamans Cherin & Mellott, LLC
- Agent Carol A. Marmo
- Main IPC: H01R4/36
- IPC: H01R4/36 ; H01R4/64 ; H01R9/24

Abstract:
The invention includes a grounding system which includes a grounding apparatus, a first ground conductor and a plurality of second ground conductors. The grounding apparatus includes a substrate and an elongated conductive member. The substrate has formed therein an aperture for receiving and electrically and mechanically engaging the first ground conductor. The elongated conductive member is mounted to a surface of the substrate and includes a plurality of lugs structured to receive and electrically and mechanically engage the plurality of second ground conductors. The substrate is structured for mounting to an exterior surface of a meter enclosure.
Public/Granted literature
- US20140148065A1 GROUNDING APPARATUS AND GROUNDING SYSTEMS INCLUDING THE SAME FOR METER ENCLOSURE MOUNTING Public/Granted day:2014-05-29
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