Invention Grant
- Patent Title: Apparatus for manufacturing semiconductor wafer
- Patent Title (中): 半导体晶片制造装置
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Application No.: US13701880Application Date: 2012-06-13
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Publication No.: US08834582B2Publication Date: 2014-09-16
- Inventor: Hongyu Zhao , Xiaohong Zhang , Likun Pei , Bao Zhang , Ruiting Wang
- Applicant: Hongyu Zhao , Xiaohong Zhang , Likun Pei , Bao Zhang , Ruiting Wang
- Applicant Address: CN Beijing
- Assignee: Beijing Sevenstar Electronics Co., Ltd.
- Current Assignee: Beijing Sevenstar Electronics Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201110441994 20111226
- International Application: PCT/CN2012/076832 WO 20120613
- International Announcement: WO2013/097420 WO 20130704
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/67 ; H01L21/677

Abstract:
The present invention provides an apparatus for manufacturing semiconductor wafer comprising at least two manipulators, at least one set of chemical gas/liquid distribution unit and an air circulating and filtering unit. The air circulating and filtering unit is separated into three regions, including the front region, the middle region, and the side region, which are controlled by respective control electric motors to achieve uniform air flow and uniform pressure in the respective regions. The cleaning degree in the internal of the apparatus can be improved by the regional control of the air circulating and filtering unit; the wafer transport efficiency can be enhanced by the double-armed manipulators having multiple degrees of freedom; and the product yield per unit area can be increased by the chemical gas/liquid distribution unit providing stable and uniform gas/liquid flow and pressure.
Public/Granted literature
- US20130160261A1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER Public/Granted day:2013-06-27
Information query
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