Invention Grant
- Patent Title: Method for isolating flexible substrate from support substrate
- Patent Title (中): 从支撑基板分离柔性基板的方法
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Application No.: US12571833Application Date: 2009-10-01
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Publication No.: US08834655B2Publication Date: 2014-09-16
- Inventor: Liang-You Jiang , Janglin Chen , Yu-Yang Chang , Dong-Sen Chen
- Applicant: Liang-You Jiang , Janglin Chen , Yu-Yang Chang , Dong-Sen Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW98112767A 20090417
- Main IPC: B32B37/00
- IPC: B32B37/00 ; H01L21/683 ; G02F1/1333
Abstract:
A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.
Public/Granted literature
- US20100264112A1 METHOD FOR ISOLATING FLEXIBLE SUBSTRATE FROM SUPPORT SUBSTRATE Public/Granted day:2010-10-21
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