A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes the steps of a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member using an electroless nickel deposition process; e) depositing a gold layer on the nickel coating using an electroless gold deposition process; and f) depositing palladium on the gold layer using an electroless palladium deposition process to improve wear resistance of the connector pads while preserving bondability of the contact pads.