Invention Grant
- Patent Title: Compressed injection molding
- Patent Title (中): 压缩注塑
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Application No.: US13845648Application Date: 2013-03-18
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Publication No.: US08834756B2Publication Date: 2014-09-16
- Inventor: Pierre Louis Todesco , Carol Su Lin Goh
- Applicant: Meiban International Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Meiban International Pte. Ltd.
- Current Assignee: Meiban International Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Priority: GB1017998.4 20101026
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C45/76 ; B29C45/77 ; B29C45/56 ; B29C45/80

Abstract:
The application provides a molding apparatus. The molding apparatus comprises a first mold-defining member together with a second mold-defining member, one or more channels, and one or more moveable cores. The first mold-defining member together with the second mold-defining member defines an internal cavity. The channels comprise inlets for receiving molten resin and outlets to the internal cavity. The moveable cores are moveable between a first position and a second position, wherein the moveable core in the second position reduces a volume of the internal cavity and closes the channel outlets. The moveable core is also independently moveable with respect to the first mold-defining member and with respect to the second mold-defining member.
Public/Granted literature
- US20130224508A1 Compressed Injection Molding Public/Granted day:2013-08-29
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