Invention Grant
- Patent Title: Method of manufacture for encased coil body
- Patent Title (中): 封装线圈体的制造方法
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Application No.: US13636101Application Date: 2011-03-17
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Publication No.: US08834765B2Publication Date: 2014-09-16
- Inventor: Junichi Esaki , Hiroyuki Kato , Yasuhiro Matsumoto
- Applicant: Junichi Esaki , Hiroyuki Kato , Yasuhiro Matsumoto
- Applicant Address: JP Nagoya-Shi, Aichi
- Assignee: Daido Steel Co., Ltd.
- Current Assignee: Daido Steel Co., Ltd.
- Current Assignee Address: JP Nagoya-Shi, Aichi
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-065308 20100320
- International Application: PCT/JP2011/056474 WO 20110317
- International Announcement: WO2011/118508 WO 20110929
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
[Problem] To provide a method of manufacture for an encased coil body, which is capable of easily manufacturing an encased coil body which is configured so as to be encased in a state where a coil is enclosed within an electrically insulating resin and is also capable of favorably preventing the coil from positional misalignment or deformation at the time of the manufacture.[Means for Solution] The method includes injection-molding a resin covering layer which encases the coil 10 with a thermoplastic resin, in which the injection-molding is carried out such that the injection-molding step is divided into a primary molding step and a secondary molding step, in which the primary molding step includes contacting a primary molding die to an inner circumferential surface of the coil 10 and molding a primary molded body 22-1 which includes an outer circumferential covering portion 46 in a state where the coil 10 is constrained so as to be positioned in a radial direction, and the secondary molding step includes, after the primary molding step, setting the primary molded body 22-1 along with the coil 10 to a secondary molding die and molding a secondary molded body which includes an inner circumferential covering portion.
Public/Granted literature
- US20130002383A1 METHOD OF MANUFACTURE FOR ENCASED COIL BODY AND ENCASED COIL BODY Public/Granted day:2013-01-03
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