Invention Grant
- Patent Title: Lithography process and structures
- Patent Title (中): 平版印刷工艺和结构
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Application No.: US13548509Application Date: 2012-07-13
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Publication No.: US08835103B2Publication Date: 2014-09-16
- Inventor: Chin Cheng Yang
- Applicant: Chin Cheng Yang
- Applicant Address: TW
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW
- Agency: Baker & McKenzie LLP
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
A photo resist layer includes a first region and a second region. A treatment layer is applied to the photo resist layer.
Public/Granted literature
- US20140017610A1 LITHOGRAPHY PROCESS AND STRUCTURES Public/Granted day:2014-01-16
Information query
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