Invention Grant
US08835219B2 Device contact, electric device package and method of manufacturing an electric device package
有权
设备接触，电气设备封装以及电气设备封装的制造方法
- Patent Title: Device contact, electric device package and method of manufacturing an electric device package
- Patent Title (中): 设备接触，电气设备封装以及电气设备封装的制造方法
-
Application No.: US13529969Application Date: 2012-06-21
-
Publication No.: US08835219B2Publication Date: 2014-09-16
- Inventor: Joachim Mahler , Khalil Hosseini
- Applicant: Joachim Mahler , Khalil Hosseini
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/48
Abstract:
An electric device and a method of making an electric device are disclosed. In one embodiment the electric device comprises a component comprising a component contact area and a carrier comprising a carrier contact area. The electric device further comprises a first conductive connection layer connecting the component contact area with the carrier contact area, wherein the first conductive connection layer overlies a first region of the component contact area and a second connection layer connecting the component contact area with the carrier contact area, wherein the second connection layer overlies a second region of the component contact area, and wherein the second connection layer comprises a polymer layer.
Public/Granted literature
- US20130341778A1 Device Contact, Electric Device Package and Method of Manufacturing an Electric Device Package Public/Granted day:2013-12-26
Information query
IPC分类:
