Invention Grant
- Patent Title: Fully molded fan-out
- Patent Title (中): 完全模制扇出
-
Application No.: US13891107Application Date: 2013-05-09
-
Publication No.: US08835230B2Publication Date: 2014-09-16
- Inventor: Christopher M. Scanlan
- Applicant: DECA Technologies Inc.
- Applicant Address: US AZ Tempe
- Assignee: DECA Technologies Inc.
- Current Assignee: DECA Technologies Inc.
- Current Assignee Address: US AZ Tempe
- Agency: Booth Udall Fuller, PLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/48 ; H01L21/78
Abstract:
A method for manufacturing a device package may include constructing a spacer element coupled with a surface of a semiconductor die unit, where the spacer element is configured to create a gap between the semiconductor die unit and a surface of a carrier, and encapsulating the semiconductor die unit within a mold compound, where the encapsulating includes introducing the mold compound into the gap.
Public/Granted literature
- US20130244376A1 FULLY MOLDED FAN-OUT Public/Granted day:2013-09-19
Information query
IPC分类:
