Semiconductor device comprising self-aligned contact elements

Invention Grant

US08835245B2 Semiconductor device comprising self-aligned contact elements 有权

Title translation: 包括自对准接触元件的半导体器件

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Patent Title: Semiconductor device comprising self-aligned contact elements
Patent Title (中): 包括自对准接触元件的半导体器件
Application No.: US13372604

Application Date: 2012-02-14
Publication No.: US08835245B2

Publication Date: 2014-09-16
Inventor: Peter Baars , Till Schloesser , Frank Jakubowski , Andy Wei , Richard Carter , Matthias Schaller
Applicant: Peter Baars , Till Schloesser , Frank Jakubowski , Andy Wei , Richard Carter , Matthias Schaller
Applicant Address: KY Grand Cayman
Assignee: GLOBALFOUNDRIES Inc.
Current Assignee: GLOBALFOUNDRIES Inc.
Current Assignee Address: KY Grand Cayman
Agency: Amerson Law Firm, PLLC
Priority: DE102011004323 20110217
Main IPC: H01L21/8234
IPC: H01L21/8234 ; H01L21/768 ; H01L21/285 ; H01L29/66 ; H01L29/78

Semiconductor device comprising self-aligned contact elements

Abstract:

When forming sophisticated semiconductor devices, a replacement gate approach may be applied in combination with a self-aligned contact regime by forming the self-aligned contacts prior to replacing the placeholder material of the gate electrode structures.

Abstract(Chinese):

当形成复杂的半导体器件时，可以在替换栅电极结构的占位符材料之前形成自对准触点，将替代栅极方法与自对准的接触方式结合使用。

Public/Granted literature

US20120211837A1 SEMICONDUCTOR DEVICE COMPRISING SELF-ALIGNED CONTACT ELEMENTS Public/Granted day:2012-08-23

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺