Invention Grant
- Patent Title: Electronic component manufacturing method including step of embedding metal film
- Patent Title (中): 电子元件制造方法，包括嵌入金属膜的步骤
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Application No.: US13163989Application Date: 2011-06-20
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Publication No.: US08835296B2Publication Date: 2014-09-16
- Inventor: Shunichi Wakayanagi , Takayuki Saito , Takuya Seino , Akira Matsuo , Koji Yamazaki , Eitaro Morimoto , Yohsuke Shibuya , Yu Sato , Naomu Kitano
- Applicant: Shunichi Wakayanagi , Takayuki Saito , Takuya Seino , Akira Matsuo , Koji Yamazaki , Eitaro Morimoto , Yohsuke Shibuya , Yu Sato , Naomu Kitano
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2010-294009 20101228
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L21/285
Abstract:
The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.
Public/Granted literature
- US20120161322A1 ELECTRONIC COMPONENT MANUFACTURING METHOD INCLUDING STEP OF EMBEDDING METAL FILM Public/Granted day:2012-06-28
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