Invention Grant
- Patent Title: Laser cutting method and method of manufacturing organic light-emitting device
- Patent Title (中): 激光切割方法及制造有机发光装置的方法
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Application No.: US12929061Application Date: 2010-12-28
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Publication No.: US08835803B2Publication Date: 2014-09-16
- Inventor: Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
- Applicant: Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
- Applicant Address: KR Yongin, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0132819 20091229
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/16 ; B23K26/40 ; B23K26/38
Abstract:
A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
Public/Granted literature
- US20110155705A1 Laser cutting method and method of manufacturing organic light-emitting device Public/Granted day:2011-06-30
Information query
