Invention Grant
- Patent Title: Memory device and fabrication process thereof
- Patent Title (中): 存储器件及其制造工艺
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Application No.: US13908680Application Date: 2013-06-03
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Publication No.: US08835895B2Publication Date: 2014-09-16
- Inventor: Jun Sumino , Shuichiro Yasuda
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2009-245597 20091026
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L45/00 ; H01L27/24 ; G11C13/00

Abstract:
A resistive-change memory element-containing memory device including: a first memory element that includes a first resistive-change layer and a first electrode connected to the first resistive-change layer; and a second memory element that includes a second resistive-change layer and a second electrode connected to the second resistive-change layer, wherein at least one of the thickness and the material of the second resistive-change layer and the area of the second electrode in contact with the second resistive-change layer is different from the corresponding one of the thickness and the material of the first resistive-change layer and the area of the first electrode in contact with the first resistive-change layer.
Public/Granted literature
- US20130299765A1 MEMORY DEVICE AND FABRICATION PROCESS THEREOF Public/Granted day:2013-11-14
Information query
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